| dc.contributor.author | Dele-Afolabi, T. T. | |
| dc.contributor.author | Hanim, M. A. Azmah | |
| dc.contributor.author | Calin, R. | |
| dc.contributor.author | Ilyas, R. A. | |
| dc.date.accessioned | 2021-01-14T18:10:32Z | |
| dc.date.available | 2021-01-14T18:10:32Z | |
| dc.date.issued | 2020 | |
| dc.identifier.citation | Bu makale açık erişimli değildir. | en_US |
| dc.identifier.issn | 0026-2714 | |
| dc.identifier.uri | https://doi.org/10.1016/j.microrel.2020.113681 | |
| dc.identifier.uri | https://hdl.handle.net/20.500.12587/12660 | |
| dc.description | WOS:000539449500021 | en_US |
| dc.description.abstract | In this work, multi-walled carbon nanotubes (MWCNTs) reinforced Sn-5Sb/Cu composite solder joints were synthesized and the effects of MWCNTs addition on the microstructure evolution and hardness of the Sn-5Sb solder alloy during various thermal aging conditions were investigated. After conducing a thorough microstructural analysis, the SbSn and Cu6Sn5 intermetallic compounds (IMCs) were observed in the beta-Sn matrix of the composite solder joints subjected to reflow soldering while the latter was also present at the solder/Cu interface. However, after subjecting the composite solder joints to isothermal aging, the Cu3Sn IMC emerged between the Cu6Sn5 IMC at the solder/Cu interface and the Cu substrate. With the promising properties exhibited by MWCNTs as a reinforcement material, experimental results showed that MWCNTs refined the bulk solder microstructure and inhibited growth of the interfacial IMC layer in the Sn-5Sb-xCNT/Cu samples. In general, the composite sample reinforced with 0.05 wt% MWCNTs showed the least IMC layer thickness and diffusion coefficient in the ranges of 2.6-11.99 mu m and 1.07 x 10(-14 )-14.9 x 10(-14) cm(2)/s respectively. Meanwhile, the strengthening mechanism triggered by MWCNTs addition was clearly evident in the MWCNT-reinforced Sn-5Sb/Cu as superior hardness values within a range of 20.6-15.3 HV were registered for the as-soldered and aged composite solder joints with 0.05 wt% MWCNTs reinforcement. | en_US |
| dc.description.sponsorship | Research Management Center, Universiti Putra Malaysia (UPM-Grant Putra) [UPM/700-2/1/GPBI/2017/9553600]; Department of Metallurgy and Materials Engineering, Kirikkale University, Turkey [BAP 2017/81, 2016/44] | en_US |
| dc.description.sponsorship | Y This study was supported by the Research Management Center, Universiti Putra Malaysia (UPM-Grant Putra; UPM/700-2/1/GPBI/2017/9553600) and the Department of Metallurgy and Materials Engineering, Kirikkale University, Turkey (project number of BAP 2017/81 and 2016/44). | en_US |
| dc.language.iso | eng | en_US |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | en_US |
| dc.relation.isversionof | 10.1016/j.microrel.2020.113681 | en_US |
| dc.rights | info:eu-repo/semantics/closedAccess | en_US |
| dc.subject | Sn-5Sb solder | en_US |
| dc.subject | Multi-walled carbon nanotubes | en_US |
| dc.subject | Isothermal aging | en_US |
| dc.subject | Microstructure | en_US |
| dc.subject | Intermetallic compound layer | en_US |
| dc.subject | Hardness | en_US |
| dc.title | Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions | en_US |
| dc.type | article | en_US |
| dc.contributor.department | KKÜ | en_US |
| dc.identifier.volume | 110 | en_US |
| dc.relation.journal | MICROELECTRONICS RELIABILITY | en_US |
| dc.relation.publicationcategory | Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı | en_US |
