Ozturk, M. S.Demircan, T.2025-01-212025-01-2120221735-35721735-3645https://doi.org/10.47176/jafm.15.06.1201https://hdl.handle.net/20.500.12587/24195This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models 1, 2, 3, and 4) of an electronic component was analysed by considering different jet-to-channel inlet velocity ratios (V-j/V-c) and ratios of the distance between the jet and impinging surface to jet diameter (H/D). The V-j/V(c )and H/D ratios were varied in the 0-3 and 2-4 ranges, respectively, in the computational fluid dynamics analysis. The thermal and flow characteristics were revealed through a comparative result analysis, also considering results from the literature. The heat transfer improved, the Nusselt number increased, and the electronic surface temperature decreased with an increase in the V-j/V-c ratio. However, the Nusselt number decreased with an increase in the H/D ratio. Models 2 and 4 had higher heat transfer from the electronic component than the other models. A low H/D ratio and low V-j/V-c ratio yielded higher heat transfer in Model 3 than in Model 1.eninfo:eu-repo/semantics/openAccessCross-flow; Impinging jet; Electronic cooling; Heat transfer; CFDArticle1561729174410.47176/jafm.15.06.12012-s2.0-85138098676Q3WOS:000859034300009Q4