Ozturk, Muhammed SerdarDemircan, Tolga2025-01-212025-01-2120221300-18841304-4915https://doi.org/10.17341/gazimmfd.799793https://hdl.handle.net/20.500.12587/25179In this study, cooling by using impinging air jet and cross-flow combination (IJCF) for an electronic component with constant heat flux is investigated. The effects of change of flow-guiding fin angle positioned inside the problem geometry on flow structure and heat transfer is considered. For this purpose, numerical analysis is conducted for different V-j/V-k (jet inlet velocity to channel inlet velocity ratio) and different fin angle is conducted with Computational Fluid Dynamics (CFD). Within this context, H/D (the ratio between the jet and impinging surface distance and jet diameter) ratio is taken constant as 3, V-j/V-k ratio values are changed as 0, 1, 2 and 3 and fin angle value (alpha) is changed 0o, 22.5 degrees, 45 degrees, 67.5 degrees and 90 degrees and simulations are repeated. To better see the effects of the fin angle, the obtained results are compared with the non-fin state. When the obtained results are analysed, with increasing fin angle (alpha) or V-j/V-k ratio when other parameters are constant, it is seen that heat transfer on the electronic component surfaces generally increased. The maximum heat transfer on the electronic component surface is reached for V-j/V-k=3 and alpha=90(o)'. It is observed that higher heat transfer can occur for higher fin angle and V-j/V-k ratio compared to other fin angles.trinfo:eu-repo/semantics/openAccessCross-flow; impinging jet; fin angle; electronic coolingArticle371577410.17341/gazimmfd.7997932-s2.0-85119929880Q2WOS:000718898200003Q4