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    Design of dual-conductive polyacrylonitrile-based composite nanofiber: Synergistic effect of copper nanoparticles decorated-boron nitride and polyaniline
    (Wiley, 2024) Orhun, Zumer; Dogan, Deniz; Erdem, Uemit; Yildirim, Gurcan; Pehlivanli, Zuhtu Onur; Metin, Aysegul Uelkue
    Conductive composite nanofibers are promising materials, especially wearable strain sensors, due to their lightweight, breathability, flexibility, and skin affinity. Here, we propose a dual-conductive network by the sequential decoration of amin-modified boron nitride nanosheets (BN), copper nanoparticles (Cu), and polyaniline (PANI) into the elastic thermoplastic polyacrylonitrile (PAN) nanofiber. The Cu nanoparticles/BN-enwrapped PANI nanocomposite was synthesized using successive environmentally friendly reduction and chemical oxidation polymerization. First, Cu (II) ions were immobilized on modified BN and reduced with L-ascorbic acid (BN@Cu), followed by a chemical oxidation polymerization of aniline using ammonium persulfate as an initiator (BN@Cu/PANI). The XRD (X-ray diffraction), FTIR (Fourier Transform Infrared Spectroscopy), SEM (Scanning Electron Microscopy), and TEM/EDXS (Transmission Electron Microscopy/Energy Dispersive X-ray Spectroscopy) analysis confirmed the coexistence of the BN@Cu/PANI phase and composition. The DC electrical conductivity of BN@Cu/PANI nanocomposite (0.567 S/cm) was quietly higher than PANI (0.167 S/cm) and BN@Cu (0.077 S/cm). The thermal conductivity of BN@Cu and BN@Cu/PANI was 0.626 and 0.444 W/mK, respectively. The BN@Cu/PANI loaded-PAN composite nanofibers were successfully produced by electrospinning. SEM studies confirmed that the composite nanofibers have uniform fiber structure and suitable BN@Cu/PANI dispersion/distribution within the PAN. BN@Cu/PANI-reinforced PAN nanofibers showed a 2-fold decrease in the specific heat capacity and a 50-fold increase in electrical conductivity of the nanofibers at 10 wt%BN@Cu/PANI loading. This work offers dual-conductive polymer-based composites, which can be used in thermal management applications in microelectronics devices.HighlightsThe dual-conductive nanocomposite, BN@Cu/PANI, was prepared a simple, low-cost method.BN@Cu/PANI, core/shell nanocomposite, was easily produced this way for the first time.BN@Cu nanoparticles increased the polymerization rate of PANI.The thermal and electrical conductivity of BN@Cu/PANI was 0.444 W/mK and 0.567 S/cm.Electrical conductivity of BN@Cu/PANI-PAN increased 50-fold increase at 10 wt%BN@Cu/PANI. The dual conductive nanocomposite (BN@Cu/PANI) was prepared using environmentally friendly reduction and chemical oxidation polymerization methods, respectively (a). The BN@Cu/PANI is used as filler in polyacrylonitrile (PAN) nanofibers prepared by electrospinning for potential applications such as soft electronics, hydrogen production, photocatalytic, and biosensors due to the lightweight and dual conductivity of composite nanofibers (b).image