Analysis of the Effect of Boron Carbide Amount on Mechanical, Thermal, and Electrical Properties of Copper Based Boron Carbide Added Composites
Yükleniyor...
Dosyalar
Tarih
2024
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Springer
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Copper is used widely due to its high conductivity and good machinability. But there are some limitations in its use due to its low mechanical resistance. In this experimental study, copper-based and boron carbide added composite materials were produced by synthesizing pure copper and boron carbide by powder metallurgy method. The effects of boron carbide additives on the microstructure, phase structure, hardness, compressive strength, abrasion resistance, thermal and electrical conductivity behavior of the copper composite were investigated. It has been observed that with the increase of boron carbide ratio in the composite structure, porous regions are formed in the microstructure, the hardness value and wear resistance increase, but the compressive strength decreases. Compared to pure copper, it was determined that the thermal conductivity coefficient of the boron carbide added composite materials decreased significantly and the specific heat capacity increased. With the addition of boron carbide, the electrical resistance of pure copper increased and its electrical conductivity decreased. However, although the conductivity decreased with the addition of boron carbide, it was still found to have higher electrical conductivity than most metals. The new generation B4C added Cu-based composite material obtained from the study can be preferred in engineering applications where the use of existing copper materials is limited and subject to higher thermal and mechanical stress. It has been evaluated that this new generation copper-based composite material can be used in engineering applications that require higher mechanical and thermal resistance and acceptable electrical conductivity.
Açıklama
Anahtar Kelimeler
B4C; copper matrix composite; Cu; microstructure; mechanical properties; thermal and electrical behavior
Kaynak
Journal of Materials Engineering and Performance
WoS Q Değeri
N/A
Scopus Q Değeri
Q2
