Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions

Basit Öğe Kaydı
dc.contributor.authorDele-Afolabi, T. T.
dc.contributor.authorHanim, M. A. Azmah
dc.contributor.authorCalin, R.
dc.contributor.authorIlyas, R. A.
dc.date.accessioned2021-01-14T18:10:32Z
dc.date.available2021-01-14T18:10:32Z
dc.date.issued2020
dc.departmentKKÜ
dc.description.abstractIn this work, multi-walled carbon nanotubes (MWCNTs) reinforced Sn-5Sb/Cu composite solder joints were synthesized and the effects of MWCNTs addition on the microstructure evolution and hardness of the Sn-5Sb solder alloy during various thermal aging conditions were investigated. After conducing a thorough microstructural analysis, the SbSn and Cu6Sn5 intermetallic compounds (IMCs) were observed in the beta-Sn matrix of the composite solder joints subjected to reflow soldering while the latter was also present at the solder/Cu interface. However, after subjecting the composite solder joints to isothermal aging, the Cu3Sn IMC emerged between the Cu6Sn5 IMC at the solder/Cu interface and the Cu substrate. With the promising properties exhibited by MWCNTs as a reinforcement material, experimental results showed that MWCNTs refined the bulk solder microstructure and inhibited growth of the interfacial IMC layer in the Sn-5Sb-xCNT/Cu samples. In general, the composite sample reinforced with 0.05 wt% MWCNTs showed the least IMC layer thickness and diffusion coefficient in the ranges of 2.6-11.99 mu m and 1.07 x 10(-14 )-14.9 x 10(-14) cm(2)/s respectively. Meanwhile, the strengthening mechanism triggered by MWCNTs addition was clearly evident in the MWCNT-reinforced Sn-5Sb/Cu as superior hardness values within a range of 20.6-15.3 HV were registered for the as-soldered and aged composite solder joints with 0.05 wt% MWCNTs reinforcement.en_US
dc.description.sponsorshipResearch Management Center, Universiti Putra Malaysia (UPM-Grant Putra) [UPM/700-2/1/GPBI/2017/9553600]; Department of Metallurgy and Materials Engineering, Kirikkale University, Turkey [BAP 2017/81, 2016/44]en_US
dc.description.sponsorshipY This study was supported by the Research Management Center, Universiti Putra Malaysia (UPM-Grant Putra; UPM/700-2/1/GPBI/2017/9553600) and the Department of Metallurgy and Materials Engineering, Kirikkale University, Turkey (project number of BAP 2017/81 and 2016/44).en_US
dc.identifier.citationBu makale açık erişimli değildir.en_US
dc.identifier.doi10.1016/j.microrel.2020.113681
dc.identifier.issn0026-2714
dc.identifier.scopus2-s2.0-85084411536
dc.identifier.scopusqualityQ2
dc.identifier.urihttps://doi.org/10.1016/j.microrel.2020.113681
dc.identifier.urihttps://hdl.handle.net/20.500.12587/12660
dc.identifier.volume110en_US
dc.identifier.wosWOS:000539449500021
dc.identifier.wosqualityQ3
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherPERGAMON-ELSEVIER SCIENCE LTDen_US
dc.relation.ispartofMICROELECTRONICS RELIABILITY
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectSn-5Sb solderen_US
dc.subjectMulti-walled carbon nanotubesen_US
dc.subjectIsothermal agingen_US
dc.subjectMicrostructureen_US
dc.subjectIntermetallic compound layeren_US
dc.subjectHardnessen_US
dc.titleMicrostructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditionsen_US
dc.typeArticle

Dosyalar

Orijinal paket
Listeleniyor 1 - 1 / 1
[ X ]
İsim:
Microstructure evolution and hardness of MWCNT-reinforced.pdf
Boyut:
3.17 MB
Biçim:
Adobe Portable Document Format
Açıklama:
Tam Metin/Full Text
İndir

Koleksiyon

WOS İndeksli Yayınlar Koleksiyonu
Makale Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu