Thermal Residual Stresses Analyses of Two-Dimensional Functionally Graded Circular Plates with Temperature-Dependent Material Properties
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Tarih
2018
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Kırıkkale Üniversitesi
Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
In this study, thermal residual stress analysisof Functionally Graded Circular Plates joined with adhesive (FGCP-A) ispresented. Finite difference equations are used in solving Navier’s equations of elasticity and heat transfer. Thegrading along the plate is made along the surface of the plate. Material properties of the plate areinvestigated depending on the temperature dependent/independent and it isassumed that the temperature independent material properties changed accordingto the Mori-Tanaka approach. Grading along the plate is made in both radial andangular directions. and nbsp; In this study, the effects of temperature dependent/independent materialproperties and compositional gradient exponents on temperature, equivalentstrain and equivalent stress are compared. and nbsp;As a result, when considering the propertiesof the material depending on the temperature, the temperature, equivalentstress and strain distributions and levels vary considerably. Therefore, theproperties of the material dependent on the temperature must be taken intoconsideration in the analysis of thermal residual stress of materials used ashigh temperature material.
Açıklama
Anahtar Kelimeler
Functionally graded circular plates, Finite difference methods, Thermal residual stress, adhesive, temperature-dependent material properties
Kaynak
Uluslararası Mühendislik Araştırma ve Geliştirme Dergisi
WoS Q Değeri
Scopus Q Değeri
Cilt
1
Sayı
2-202
