Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

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dc.authoridDele-Afolabi, Temitope Theophilus/0000-0003-0187-9208
dc.contributor.authorDele-Afolabi, T. T.
dc.contributor.authorHanim, M. A. Azmah
dc.contributor.authorVidyatharran, K.
dc.contributor.authorMatori, K. A.
dc.contributor.authorAzlina, O. Saliza
dc.contributor.authorCalin, R.
dc.date.accessioned2025-01-21T16:41:50Z
dc.date.available2025-01-21T16:41:50Z
dc.date.issued2022
dc.departmentKırıkkale Üniversitesi
dc.description.abstractThe combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1 wt%) were successfully synthesized through the powder metallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)(6)Sn-5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finish material, the SAC-xCNT/ENIAg exhibited IMC thickness values within the range of 2.98-2.65 mu m as compared to the 5.23-3.61 mu m demonstrated by the SAC-xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibiting the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively.
dc.description.sponsorshipUniversiti Putra Malaysia (UPM) Research Grant (UPMGRANT Putra) [UPM/GP-IPB/2020/9688700]; Ministry of Higher Education Malaysia (KPT) Research Grant [FRGS/2012/5524194]
dc.description.sponsorshipThis research was fully funded by the Universiti Putra Malaysia (UPM) Research Grant (UPMGRANT Putra, UPM/GP-IPB/2020/9688700), and the Ministry of Higher Education Malaysia (KPT) Research Grant (FRGS/2012/5524194).
dc.identifier.doi10.1007/s10854-022-07974-8
dc.identifier.endpage8246
dc.identifier.issn0957-4522
dc.identifier.issn1573-482X
dc.identifier.issue10
dc.identifier.scopus2-s2.0-85125714874
dc.identifier.scopusqualityQ2
dc.identifier.startpage8233
dc.identifier.urihttps://doi.org/10.1007/s10854-022-07974-8
dc.identifier.urihttps://hdl.handle.net/20.500.12587/24964
dc.identifier.volume33
dc.identifier.wosWOS:000765736100002
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherSpringer
dc.relation.ispartofJournal of Materials Science-Materials In Electronics
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_20241229
dc.titleInterfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
dc.typeArticle

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